Spin Etching spin coater

Spin Etching

REQUIREMENTS:
√ Spin Process Station

RECOMMENDED MODELS:
√ Up to 150mm: POLOS SPIN150i-NPP* / POLOS 200 Advanced NPP*
√ Up to 200mm: POLOS SPIN200i-NPP / POLOS 200 Advanced NPP*
√ Up to 300mm: POLOS 300 Advanced*

Puddle etching method of thin film by using spin coater
*All unit are suitable for Puddle Etching processes, speedrates can be set from 1 up to 7.000 rpm, chuck turning can be programmed to rotate alternating between clockwise and counter clockwise.

CHECK CHEMICAL COMPATIBILITY OF YOUR PROCESS WITH THE NPP OR PTFE BOWL-MATERIAL.

Example Etching

About spincoating.com

POLOS spin coaters and spin processors are specially build in Germany for SPS-Europe. Our spinners meet the highest quality standards for the Semiconductor, Biotechnology, and Nanotechnology industries.

CONTACT US:
Phone: +31 341 360 590

Applications

Spin coater Drying
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.

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Rinse / Cleaning
Rinse / CleaningTraditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning.

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Spin Etching
Puddle etching method of thin film by using spin coater. All unit are suitable for Puddle etching processes.

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Manual Coating
Manual Dispense Spin Coater are perfectly suitable for a wide range of applications, including drying rinsing cleaning, and coating.

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Automatic Coating
Automatic Dispense Spin coater are perfectly suitable for a wide range of applications, including drying, rinsing, cleaning, and coating.

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Spin Coater Developing
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.

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Terms