Substrate size ≤ 150mm
Substrate size ≤ 200 mm
Substrate size ≤ 300mm
Substrate size ≥ 450mm
Spin Process Stations

Spin Etching

REQUIREMENTS:
  Spin Process Station

RECOMMENDED MODELS:
  Up to 150mm: POLOS SPIN150i-NPP* / POLOS 200 Advanced NPP*
  Up to 200mm: POLOS SPIN200i-NPP / POLOS 200 Advanced NPP*
  Up to 300mm: POLOS 300 Advanced*

    Puddle etching method of thin film by using spin coater
    *All unit are suitable for Puddle Etching processes, speedrates can be set from 1 up to 7.000 rpm, chuck turning can be programmed to rotate alternating between clockwise and counter clockwise.

    CHECK CHEMICAL COMPATIBILITY OF YOUR PROCESS WITH THE NPP OR PTFE BOWL-MATERIAL.

                                                                                                  Example Etching

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