Spin Coater Developing
Spin Coater Developing
SPIN COATER REQUIREMENTS:
√ Spin coater POLOS Advanced with Automatic Chemical Dispense
√ Teflon® (PTFE) Housing
√ Exhaust / Drain Combination
√ Dispense Vessel
SPIN COATER OPTIONS:
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.
√ Centering Tool
√ Backside Rinse
√ Edge Bead Removal
√ Additional Injector Lines
√ Auto Lid-Lock
SPIN COATER RECOMMENDED MODELS:
Up to 150mm:
√ SPIN COATER SPIN150i in PTFE or POLOS 150 Advanced PTFE
Up to 200mm:
√ SPIN COATER SPIN200i in PTFE or POLOS 200 Advanced PTFE
Up to 300mm:
√ SPIN COATER POLOS 300 Advanced PTFE
CHECK CHEMICAL COMPATIBILITY OF YOUR PROCESS WITH THE NPP OR PTFE BOWL-MATERIAL.
Applications
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Rinse / CleaningTraditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning.
Puddle etching method of thin film by using spin coater. All unit are suitable for Puddle etching processes.
Manual Dispense Spin Coater are perfectly suitable for a wide range of applications, including drying rinsing cleaning, and coating.
Automatic Dispense Spin coater are perfectly suitable for a wide range of applications, including drying, rinsing, cleaning, and coating.
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.