Spin coater Drying
Spin coater Drying
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Please find below our cost-effective POLOS SPIN150i and SPIN200i spin processors for spin drying. With a low contact mechanical chuck no vacuum line or vacuum pump is required.
Requirements:
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Use Low Contact Chuck (non-vacuum chuck) only the edge of the substrate is in contact with the chuck
Application:
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Single Wafer Chemical or Residual Removal
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Spin, Rinse, and Dry semiconductor wafers after a wet process
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Cleaning up to 300mm wafers utilizing DI Water Rinse, followed by heated N2 dry
Recommended models*:
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Up to 150mm: SPIN COATER SPIN150i-NPP
- Up to 200mm: SPIN COATER SPIN200i-NPP
- Up to 300mm: SPIN COATER POLOS 300 Advanced NPP
* Models are standard supplied with vacuum chuck , mechanical chucks are optionally available, depending on substrate.
Note: For batch applications: sps-europe.com offer refurbishment services of your SRD Spin Rinse Dryers. Contact us!
