Automated etching system
Spin processor for spin etching with controllable flow rate and mixture ratio
- Linear movable dispense arm with multiple dispensing and spraying lines
- HD motor drive suitable for chemical saver “puddle” etching
- Highly accurate Per step programmable flow rate and mixing ratio
- Suitable for static or dynamic dispensing among all substrate surface
- Nitrogen dry optionally available through dome or movable arm
- Substrate Front & Back Side In Situ Di Water Rinse
- Mandatory safety cycle for chamber neutralization at unit start-up
- Submersed process chamber for safe processing of dangerous chemical
- Equipped with 10l PTFE process tanks for chemical storage and preparation
- Available with automated or manual filling system
- Optionally available integrated with 3.5kW PFA Bath Heating System for Process Tank.
- Full-Plastic enclosure in Natural Polypropylene (NPP)
- For substrate up to Ø 200 mm
