Spin Process Station

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Automated etching system

Spin processor for spin etching with controllable flow rate and mixture ratio

  • Linear movable dispense arm with multiple dispensing and spraying lines
  • HD motor drive suitable for chemical saver “puddle” etching
  • Highly accurate Per step programmable flow rate and mixing ratio
  • Suitable for static or dynamic dispensing among all substrate surface
  • Nitrogen dry optionally available through dome or movable arm
  • Substrate Front & Back Side In Situ Di Water Rinse
  • Mandatory safety cycle for chamber neutralization at unit start-up
  • Submersed process chamber for safe processing of dangerous chemical
  • Equipped with 10l PTFE process tanks for chemical storage and preparation
  • Available with automated or manual filling system
  • Optionally available integrated with 3.5kW PFA Bath Heating System for Process Tank.
  • Full-Plastic enclosure in Natural Polypropylene (NPP)
  • For substrate up to Ø 200 mm

See also our other models:


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Spin Process Station

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