Prosys Megasonic Megpie option on POLOS Spin Processor:

• Reduces media consumption
• Increases throughput
• Improves  uniformity
• Prevents damages
• Enables process control

Offers a fully integrated solution for megasonic processing, rinsing and drying.

Multiple recipe capacity and process parameter monitoring and reporting assure higher uniformity & repeatability control.

The Megpie is suitable from fragments up to 450mm round or square substrates, we offer customizable chuck adapters for multiple substrate size usage. A Dual Zone model is available for higher efficiency. 

Advantages:

• Exceptional large-area and high-aspect- ratio feature coverage
• Very high die-to-die and wafer-to-wafer uniformity
• Wet process energy efficiency
  • Reduced process times (60-80%)
  • Reduced media usage (up to 90%)
• On-the-fly process control/monitoring

• ‐ Ration uniform dose of energy on your substrate

•  Less water usage

•  Faster cleaning times, more throughput

•  Particles will be flushed away as soon as they release, less resonant time, resulting in a more efficient cleaning.

 Applicable Processes:

• Post CMP, TSV, Post Laser Cleaning
• Pre-Bond, Pre-Dep, Mask Cleaning
• SU8 and Thick Resist Develop
• Lift Off, Resist Strip, Etch assist,
  Pre-Plating process