Centering aid for Polos 300
One tool for substrate sizes from 6" up to 12" and square substrates upto 8"x8"
POLOS
F-Sx-POLOS300
Product description
POLOS
F-Sx-POLOS300
Specifications
Brand
POLOS
Product Number
F-Sx-POLOS300
Applications
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Rinse / CleaningTraditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning.
Puddle etching method of thin film by using spin coater. All unit are suitable for Puddle etching processes.
Manual Dispense Spin Coater are perfectly suitable for a wide range of applications, including drying rinsing cleaning, and coating.
Automatic Dispense Spin coater are perfectly suitable for a wide range of applications, including drying, rinsing, cleaning, and coating.
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.