DS-PER-VI for all watery fluids 0-15 psi (0-1 bar)
For applications that require a high degree of process control. All units feature vacuum control, a convenient Teach function that makes it simple to set initial shot size, and an I/O connection.
The dispenser includes a digital vacuum display that adds an extra degree of process control.
The Dispense System increases throughput, improves yields, and reduces production costs through controlled application of adhesives, lubricants and other assembly fluids.
Features
- Digital Dispense Time Display
- Digital Air Pressure Display
- Adjustable Dispense Time, Air pressure and Vacuum
- Timed, Steady or Teach operation
- Vacuum control keeps thin fluids from dripping
- I/O connector
-
Electric foot pedal
- Delivered with a wide range of accessories
Dispense (0-1 bar)
Applications
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Rinse / CleaningTraditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning.
Puddle etching method of thin film by using spin coater. All unit are suitable for Puddle etching processes.
Manual Dispense Spin Coater are perfectly suitable for a wide range of applications, including drying rinsing cleaning, and coating.
Automatic Dispense Spin coater are perfectly suitable for a wide range of applications, including drying, rinsing, cleaning, and coating.
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.