Fragments
Dies, Wafer, Fragments, etc.
Chucks
Customized vacuum or mechanical chucks are available for almost any application.
Chucks are available in following materials:
- PP: NPP with EPDM o-ring
- FP: PTFE (TFM 1600 with FKM o-ring) alternatively for thin substrates: porous PTFE
Note: other materials available on request, please contact us for details.
Round Substrates
Vacuum for 2" up to 300mm Wafer.
Vacuum for 2" up to 300mm Wafer.
Low Contact
Round Substrates
Vacuum and Centering pins.
Vacuum and Centering pins.
Square Substrates
Mask, Solar Cells, etc.
Mask, Solar Cells, etc.
Round Substrates
Mechanical and Centering pins.
Mechanical and Centering pins.
Regular Substrates
Labaratory Glass, etc.
Labaratory Glass, etc.
Thin, Fragile, Substrates
Foils, etc.
Foils, etc.
Applications
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Rinse / CleaningTraditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning.
Puddle etching method of thin film by using spin coater. All unit are suitable for Puddle etching processes.
Manual Dispense Spin Coater are perfectly suitable for a wide range of applications, including drying rinsing cleaning, and coating.
Automatic Dispense Spin coater are perfectly suitable for a wide range of applications, including drying, rinsing, cleaning, and coating.
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.