Uniform spin coating up to 12,000 rpm
Uniform spin coating up to 12,000 rpm
Spin etch – develop – clean - coat
Spin etch – develop – clean - coat
Megasonic cleaning on spin coater
Megasonic cleaning on spin coater
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World Wide Support
2 year warranty
Custom System Configuration

Both spin coaters the POLOS SPIN200i and POLOS Advanced 200 are suitable for processing fragments of  Ø 200 mm / 8 inch wafers (or Ø 260 mm substrates), or 6"x6" square substrates.

Both models are available in Table top of In Deck models for integration into your wetbench.

The POLOS SPIN series standard comes with 3 I/O ports, to hook up with for example a foot-pedal for hands-free operation or dispense units. 

The POLOS Advanced can be completely customized to customer demands, including domed lid and multiple chemical dispense lines. The Polos Advanced series allow the user to either dispense manually through the syringe or by using the optional manifold, with selectable valve(s) for dispensing chemical from the Dispense Vessel (DV), DI Water or N2.

Includes a FREE vacuum chuck

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