Etching
Automated etching system
Spin processor for spin etching with controllable flow rate and mixture ratio
- Linear movable dispense arm with multiple dispensing and spraying lines
- HD motor drive suitable for chemical saver “puddle” etching
- Highly accurate Per step programmable flow rate and mixing ratio
- Suitable for static or dynamic dispensing among all substrate surface
- Nitrogen dry optionally available through dome or movable arm
- Substrate Front & Back Side In Situ Di Water Rinse
- Mandatory safety cycle for chamber neutralization at unit start-up
- Submersed process chamber for safe processing of dangerous chemical
- Equipped with 10l PTFE process tanks for chemical storage and preparation
- Available with automated or manual filling system
- Optionally available integrated with 3.5kW PFA Bath Heating System for Process Tank.
- Full-Plastic enclosure in Natural Polypropylene (NPP)
- For substrate up to Ø 200 mm
| Specifications | |
| Available number of programs | 999 |
| Steps per program | 100 |
| Spin speed* | 1 - 10,000 rpm** ± 1rpm steps |
| Spin speed accuracy | ± 0.1 rpm ** |
| Spin rotational direction | Clockwise, Counter clockwise |
| Max. acceleration | 30,000 rpm/sec |
| Acceleration accuray | ± 0.1 rpm/sec |
| Spin speed read out accuray | ± 0.1 rpm |
| System data | |
| Interface | Keyboard and LCD full size display, chemical resistant, IP50 |
| Tank model | 3x PTFE process tank, 10 L effective volume |
| Utilities | DIW spray gun, N2 spray gun, vacuum wand, front light indicators |
| Chamber diameter | 302 mm |
| Dimension (desktop version) | 1400 (w) x 1600 (h) x 950 (d) mm |
| Safety | Leak sensor, drain sensor, exhaust monitor, ShutDown supply valve |
