All spin coaters come standard with a chuck included. NPP material for standard units, PTFE for PTFE units.
The SPIN150i for up to 150mm substrates includes vacuum chuck A-V36 and fragment adaptor D-V10 (for 10mm and up).
The other models come standard with vacuum chuck A-V78.
Customized vacuum or mechanical chucks are available for almost any application.
Chucks are available in following materials:
- PP: NPP with EPDM o-ring
- FP: PTFE (TFM 1600 with FKM o-ring) alternatively for thin substrates: porous PTFE
Note: other materials and custom design spin coater chucks are available on request, please contact us for details.
Round SubstratesVacuum Chucks (Type A)
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Round SubstratesVacuum with Centering Pins (Type B)
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Round SubstratesNon-Vacuum with Centering Pins (Type C)
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FragmentsFragment Adapter (Type D)
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Low-Contact - Square & MasksNon-Vacuum for Square Substrates (Type E)
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Low Contact – Round SubstratesNon-Vacuum for Cleaning Drying (Type H)
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Thin, Fragile, Substrates & FoilAdapter with perforated surface (Type J)
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Laboratory Glass, RectangularChuck for Embedded Substrates (Type K)
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POLOS spin coaters and spin processors are specially build in Germany for SPS-Europe. Our spinners meet the highest quality standards for the Semiconductor, Biotechnology, and Nanotechnology industries. Go to SPS-Europe.
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Rinse / CleaningTraditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning.
Puddle etching method of thin film by using spin coater. All unit are suitable for Puddle etching processes.
Manual Dispense Spin Coater are perfectly suitable for a wide range of applications, including drying rinsing cleaning, and coating.
Automatic Dispense Spin coater are perfectly suitable for a wide range of applications, including drying, rinsing, cleaning, and coating.
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.