POLOS450 SPIN COATER
THE POLOS 450 SPIN COATER
Table Top Model, stand alone version, for substrates up to 450 mm diameter, manual chemical dispense, 2 automatic static dispense lines, pneumatic lid opening and closing, chuckadapter and one vacuumchuck for up to 3 wafersizes, speed max 1500 rpm, chamber max diameter approx 450 mm
TYPICAL APPLICATIONS FOR THE POLOS 450 SPIN COATERS:
Specifications:
- Table Top Model, stand alone version
- For substrates up to 450 mm diameter
- Manual chemical dispense, 2 automatic static dispense lines
- Pneumatic lid opening and closing
- Chuck adapter and one vacuum chuck for up to 3 wafer sizes
- Speed max 1500 rpm
Chamber max diameter approx. 450 mm
Call us
+31 341 360 590
+31 341 360 590
Applications
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Rinse / CleaningTraditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning.
Puddle etching method of thin film by using spin coater. All unit are suitable for Puddle etching processes.
Manual Dispense Spin Coater are perfectly suitable for a wide range of applications, including drying rinsing cleaning, and coating.
Automatic Dispense Spin coater are perfectly suitable for a wide range of applications, including drying, rinsing, cleaning, and coating.
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.