POLOS Micro Writer
THE POLOS µWriter
The POLOS µWriter is a high end/low cost direct optical lithography system oriented to universities and research facilities looking to expand their capabilities.
- High end/low cost lithography
- Very robust and simple
- Reduced requirements and easier maintenance
Technical specifications
- Typical writing speed: 100 - 120 mm/s
- Maximum area: 100 x 92 mm^2
- Mech. Short range noise onslow and on fast axis: < 1µm
- Realistic minimum feature size 6 - 15 µm depending on the feature
Multiple designs from different files can be written in one process. Tilted/warped substrate compensation via 3-point focus or 4-point bilinear measurement. Mesh type calibration for full-bed curvature.
Optics
Recommended raster step of included objectives:
Fine (40x NA0.65): 0.8 µm
Medium (10x NA0.25): 2 µm
Coarse (4x NA0.1): 5 µm
Effective writing speed of included objectives on big areas (unidirectional writing):
Fine: 1.7 mm2/min
Medium: 4.25 mm2/min
Coarse: 10.6 mm2/min
Please fill in our contact form to get a quote/ more information.
Call us
+31 341 360 590
+31 341 360 590
Applications
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Rinse / CleaningTraditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning.
Puddle etching method of thin film by using spin coater. All unit are suitable for Puddle etching processes.
Manual Dispense Spin Coater are perfectly suitable for a wide range of applications, including drying rinsing cleaning, and coating.
Automatic Dispense Spin coater are perfectly suitable for a wide range of applications, including drying, rinsing, cleaning, and coating.
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.