Spin Etching
Spin Etching
REQUIREMENTS:
√ Spin Process Station
RECOMMENDED MODELS:
√ Up to 150mm: POLOS SPIN150i-NPP* / POLOS 200 Advanced NPP*
√ Up to 200mm: POLOS SPIN200i-NPP / POLOS 200 Advanced NPP*
√ Up to 300mm: POLOS 300 Advanced*
Puddle etching method of thin film by using spin coater
*All unit are suitable for Puddle Etching processes, speedrates can be set from 1 up to 7.000 rpm, chuck turning can be programmed to rotate alternating between clockwise and counter clockwise.
CHECK CHEMICAL COMPATIBILITY OF YOUR PROCESS WITH THE NPP OR PTFE BOWL-MATERIAL.
Applications
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Rinse / CleaningTraditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning.
Puddle etching method of thin film by using spin coater. All unit are suitable for Puddle etching processes.
Manual Dispense Spin Coater are perfectly suitable for a wide range of applications, including drying rinsing cleaning, and coating.
Automatic Dispense Spin coater are perfectly suitable for a wide range of applications, including drying, rinsing, cleaning, and coating.
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.