Spin coater Drying
Spin coater Drying
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Please find below our cost-effective POLOS SPIN150i and SPIN200i spin processors for spin drying. With a low contact mechanical chuck no vacuum line or vacuum pump is required.
Requirements:
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Use Low Contact Chuck (non-vacuum chuck) only the edge of the substrate is in contact with the chuck
Application:
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Single Wafer Chemical or Residual Removal
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Spin, Rinse, and Dry semiconductor wafers after a wet process
- Cleaning up to 300mm wafers utilizing DI Water Rinse, followed by heated N2 dry
Recommended models*:
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Up to 150mm: SPIN COATER SPIN150i-NPP
- Up to 200mm: SPIN COATER SPIN200i-NPP
- Up to 300mm: SPIN COATER POLOS 300 Advanced NPP
* Models are standard supplied with vacuum chuck , mechanical chucks are optionally available, depending on substrate.
Note: For batch applications: sps-europe.com offer refurbishment services of your SRD Spin Rinse Dryers. Contact us!
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Rinse / CleaningTraditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning.
Puddle etching method of thin film by using spin coater. All unit are suitable for Puddle etching processes.
Manual Dispense Spin Coater are perfectly suitable for a wide range of applications, including drying rinsing cleaning, and coating.
Automatic Dispense Spin coater are perfectly suitable for a wide range of applications, including drying, rinsing, cleaning, and coating.
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.