Substrate size ≤ 150mm
Substrate size ≤ 200 mm
Substrate size ≤ 300mm
Substrate size ≥ 450mm
Spin Process Stations

 

Rinse / Cleaning

Traditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning. SPS-Europe offer a range of PTFE or Heated Quartz Tanks.

Newer cleaning methods, where fresh chemicals are continuously supplied to the substrate, include single wafer spin cleaning. Standard configurations are available for cleaning wafers as well as photomasks.

New single wafer spin cleaning technologies, such as SCROD, which alternately uses ozonated water and dilute HF at room temperature, with or without added help of megasonics are succesfully being used with our POLOS Advanced Spin Coaters.

Successfully installed at customers worldwide, e.g. FhG ENAS in Germany.

APPLICATIONS:

  Si Wafer Cleaning

  Mask Cleaning

  Metal Lift Off

  Post-CMP Cleaning: Example Post-CMP Cleaning


REQUIREMENTS:

  Choice of Vacuum or Non-Vacuum Chuck

  Basic up to 3 lines (SPIN) or Automatic Chemical Dispense (POLOS Advanced)


OPTIONAL:

  BSR Back-Side Rinse, with adjustable position and spray angle
(only with mechanical chucks)


RECOMMENDED MODELS:

Manual / Automatic Dispense

Contact us for your best spin cleaning configuration!

* Teflon® (PTFE) units are available, depending on chemicals.

CHECK CHEMICAL COMPATIBILITY OF YOUR PROCESS WITH THE NPP OR PTFE BOWL-MATERIAL.

Example Post-CMP Cleaning

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