APPLICATIONS
The SPIN COATER applications
Single substrate spin processing is widely used in the semiconductor industry, where spin coating can be used to create thin films of less than 10nm thickness. Spin processing can be used for cleaning or etching. Most substrates can be spin processed, including wafers, microscopeslides, photomasks, or even small pieces etc.
Our POLOS spin coaters are used for both cleaning applications as well as photolithography, to deposit layers of photoresist typically 1 micrometer thick. POLOS spin coaters are available for all sizes, ranging from small pieces to large 450 mm diameter substrates.
Applications
The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.
Rinse / CleaningTraditional batch hydrogen peroxide-based wafer cleaning methods involve immersion in tanks for RCA and SC2 cleaning.
Puddle etching method of thin film by using spin coater. All unit are suitable for Puddle etching processes.
Manual Dispense Spin Coater are perfectly suitable for a wide range of applications, including drying rinsing cleaning, and coating.
Automatic Dispense Spin coater are perfectly suitable for a wide range of applications, including drying, rinsing, cleaning, and coating.
A full range of substrate size matching vacuum or non-vacuum chucks is available, for easy centering.