Applications >> Spin Etching

NON-STANDARD APPLICATION:
SINGLE WAFER SPIN ETCH PROCESSING:

• Polymer Clean
• Layer Etching / Thinning
• Film Removal / Lift-Off
• Other Manufacturing Applications

REQUIREMENTS:

• Additional Safety Features, for example:
  Process Interlocks:
  e.g. mechanical lid-lock: lid can not be opened unless process is finished
• Chemical Supply Cabinet
• Conductivity-Controlled Cleaning Cycles

RECOMMENDED MODELS: Automatic Chemical Dispense (ACD):

• Up to 150mm: POLOS ACD200-PTFE-HD*
• Up to 200mm: POLOS ACD200-PTFE-HD*
• Up to 300mm: POLOS ACD300-PTFE-HD* 

* These unit are suitable for Puddle Etch processes, speedrates can be set from 1 up to 7.000 rpm, chuck turning can be programmed to rotate alternating between clockwise and counter clockwise.

CHECK CHEMICAL COMPATIBILITY OF YOUR PROCESS WITH THE NPP OR PTFE BOWL-MATERIAL.

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